• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, April 12, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » U.S. Department of Commerce Awards $458M to SK hynix

U.S. Department of Commerce Awards $458M to SK hynix

December 19, 2024
in All
A A

The U.S. Department of Commerce has awarded up to $458 million in direct funding to SK hynix under the CHIPS Incentives Program. The funding supports the company’s $3.87 billion investment in West Lafayette, Indiana, to develop a cutting-edge memory packaging plant and advanced packaging R&D facility. This initiative aims to address a critical gap in the U.S. semiconductor supply chain, especially for AI-driven high-bandwidth memory (HBM) products.

The funding, part of the bipartisan CHIPS and Science Act, will be disbursed in stages tied to project milestones. SK hynix’s partnership with Purdue University will establish a research hub to advance HBM and semiconductor packaging technologies, strengthening the U.S. semiconductor ecosystem. The project is expected to generate approximately 1,000 permanent facility jobs and hundreds of construction jobs, enhancing Indiana’s role in the global AI hardware supply chain.

“By investing in SK hynix and West Lafayette, we’re bolstering America’s global technology leadership and securing critical AI supply chain components,” said Commerce Secretary Gina Raimondo. The CHIPS Program Office also announced $500 million in loans to SK hynix, supplementing the direct funding and supporting long-term capital expenditures tied to the project.

Key Points

• Funding: Up to $458 million in direct funding and $500 million in loans through the CHIPS Incentives Program.

• Investment: SK hynix is investing $3.87 billion in West Lafayette, Indiana, for advanced packaging and R&D facilities.

• Jobs Created: Approximately 1,000 permanent jobs and hundreds of construction jobs.

• Focus: High-bandwidth memory (HBM) and advanced semiconductor packaging to meet AI supply chain demands.

• Partnership: Collaboration with Purdue University to create a research hub.

“SK hynix looks forward to collaborating with the U.S. government, the State of Indiana, Purdue University, and our U.S. business partners to build a robust and resilient AI semiconductor supply chain in the U.S.,” said SK hynix CEO Kwak Noh-Jung.

ShareTweetShare
Previous Post

U.S. Department of Commerce Announces $450M Open RAN Innovation Fund

Next Post

Samsung Secures $4.745 Billion in CHIPS Act Funding

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Cisco, G42, and AMD to Build AI Infrastructure in the UAE
AI Infrastructure

DigitalBridge Teams with KT for AI Data Centers in Korea

November 26, 2025
BerryComm Expands Central Indiana Fiber with Nokia
5G / 6G / Wi-Fi

Telefónica Germany Awards Nokia a 5-Year RAN Modernization Deal

November 26, 2025
AMD’s Compute + Pensando Network Architecture Powers Zyphra’s AI 
AI Infrastructure

AMD’s Compute + Pensando Network Architecture Powers Zyphra’s AI 

November 25, 2025
Bleu, the “Cloud de Confiance” from Capgemini and Orange
Clouds and Carriers

Orange Business Begins Migration of 70% of IT Infrastructure to Bleu Cloud

November 25, 2025
Dell’s server and networking sales rise 16% yoy
Financials

Dell Raises FY26 AI Infrastructure Outlook as AI Server Shipments Surge 150%

November 25, 2025
GlobalFoundries acquires Tagore Technology’s GaN IP
Optical

GlobalFoundries Acquires InfiniLink for Silicon-Photonics Expertise

November 25, 2025
Next Post
CHIPS for America allocates $3 billion for National Advanced Packaging

Samsung Secures $4.745 Billion in CHIPS Act Funding

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version