3M and US Conec have signed a licensing agreement to integrate 3M’s Expanded Beam Optical Interconnect technology into high-density connectivity solutions. This partnership leverages 3M’s advanced optical systems and US Conec’s expertise in precision manufacturing to support hyperscale data centers and emerging network architectures.
The 3M Expanded Beam Optical Interconnect offers single-mode and multimode configurations, using non-contact optical coupling to minimize contamination and wear. Its robust design improves performance in demanding environments, reducing maintenance costs and downtime. US Conec will manufacture and supply products based on this technology, ensuring a steady supply chain for global network deployments.
“This collaboration supports our goal of delivering innovative connectivity solutions for next-generation networks,” said Mike Hughes, VP of Product Management at US Conec. Kevin Twomey, 3M’s Global Portfolio Director, added that the agreement helps meet the scalability and reliability demands of modern data infrastructure.
• Licensing agreement merges 3M’s optical interconnects with US Conec’s high-density connectivity expertise.
• Technology supports hyperscale data centers and edge computing environments.
• Expanded Beam Optical Interconnect is available in single-mode and multimode options.
• Non-contact design reduces contamination and wear, lowering maintenance needs.
• US Conec will handle manufacturing and supply chain responsibilities.
“We’re excited to partner with US Conec to bring the benefits of 3M Expanded Beam Optical Interconnect technology to the market,” said Kevin Twomey, Global Portfolio Director, 3M Electronics Materials Solutions Division.
