The Ethernet Alliance conducted a multi-vendor interoperability test of Small Form Factor Pluggable (SFP+) short-reach (10GBASE-SR) and long-reach (10GBASE-LR) optical interfaces.
The testing was recently held at the University of New Hampshire Interoperability Lab (UNH-IOL) by the Ethernet Alliance SFP+/EDC subcommittee and included AMCC, Avago Technologies, Broadcom, ClariPhy, Cortina Systems, ExceLight Communications, Finisar, Gennum, Inphi, Intel, JDSU, MergeOptics, NetLogic Microsystems, Opnext and Vitesse.
The test demonstrated multiple SFP+ SR and LR optical transceivers and physical layer (PHY) ICs interoperating over 270 meters of OM3 multimode fiber and 10 km of single-mode fiber. In addition, the group demonstrated multiple SFP+ SR and LR optical transceivers and PHY ICs interoperating with XENPAK, X2, and XFP optical transceivers over the same distances.
SFP+ modules are hot-pluggable, small-footprint optical transceivers intended for datacom applications. SFP+ interfaces offer the smallest, lowest-power solution for 10 Gigabit Ethernet (10GbE) to enable increased density in enterprise applications.
SFP+ modules and PHY ICs are being developed for SR, LR, LRM (long-wavelength multimode) and ER (extra-long-wavelength) optical reaches per IEEE Std. 802.3ae-2002 and IEEE Std. 802.3aq-2006. Electrical and mechanical interface specifications for SFP+ modules, direct attach cables, and hosts are under definition by the SFF Committee, a multi-source agreement group with broad industry participation.
“We expect the move to smaller SFP+ modules will help increase the port density and reduce the cost of 10 Gigabit Ethernet line cards,” said Jag Bolaria, senior analyst, Linley Group. “Demonstrating interoperability between 10GBASE-SR and 10GBASE-LR SFP+ modules with existing XENPAK, X2 and XFP modules showcases the readiness for deployment of SFP+ modules.”http://www.ethernetalliance.org
