Amit Nagra, VP and GM, Silicon Photonics Product Division from Intel, shares an update on progress in silicon photonics, wafer manufacturing, and 1.6T components following this year’s OFC24:
– Intel’s strategic shift in the pluggable market: Instead of providing the full transceiver module, Intel is now focusing on supplying the key chipsets that go into these modules. Interestingly, five out of the six key pieces of silicon that go into a module can be sourced internally from Intel.
– Investment in photonics wafer manufacturing technology: Intel continues to invest in this technology in their New Mexico Fab, developing a next-generation process that improves the size, capability, speeds, and features of the process. This investment also allows Intel to transform the economics to create very compelling and cost-competitive silicon photonic solutions.
– Announcement of 1.6 Tbps components: At OFC 2024, Intel announced 1.6 Tbps components, both on the transmit side and the receive side, supporting 200G/lane for both the DR and FR formats. Intel aims to have the same coverage of the five components, including the transmitter PIC, the receiver PIC, and the associated electronics IC (EIC) and controller IC.
Learn more at www.intel.com/siliconphotonics
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Check out OFC Conference and Exposition 2024 videos here: https://ngi.fyi/ofc24yt
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