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Home » What’s hot at OFC22? Cudoform stamping for Co-Packaged Optics

What’s hot at OFC22? Cudoform stamping for Co-Packaged Optics

March 17, 2022
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Many companies are looking for new solution for integrating optics with electronics in a single package to shorten electrical link lengths and reduce power, says R. Ryan Vallance, CEO and CTO, Cudoform.

Cudoform specializes in high-accuracy stamping of metallic components, proving an innovative way to bring light into co-packaged optics.

https://youtu.be/eqj9jiazEJ0

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