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Home » Xiaomi Debuts its own 3nm Chipset

Xiaomi Debuts its own 3nm Chipset

May 27, 2025
in Semiconductors
A A

Xiaomi unveiled its first self-developed flagship chipsets—the XRING O1 3nm SoC and XRING T1 4G smartwatch SoC—during a high-profile product launch in Beijing themed “A New Beginning.” The debut marks a major milestone in Xiaomi’s ambitions to become a vertically integrated tech company, aligning chip, software, and AI under a unified development roadmap. The XRING O1 will power the new Xiaomi 15S Pro and Xiaomi Pad 7 Ultra, while the XRING T1 will appear in the 15th Anniversary Edition of the Xiaomi Watch S4.

Built using a second-generation 3nm process node and packing 19 billion transistors, the XRING O1 features a 10-core CPU architecture with dual Cortex-X925 performance cores clocked at 3.9 GHz and a 16-core Immortalis-G925 GPU. The chip integrates Xiaomi’s fourth-generation ISP, a 6-core NPU capable of 44 TOPS, and is optimized for AI-powered functions like semantic search and camera enhancements. The XRING T1 smartwatch SoC, meanwhile, is the first from Xiaomi to incorporate a proprietary 4G baseband and eSIM capability, enabling independent communication with improved power efficiency and performance across more than 100 cities during real-world testing.

The Xiaomi 15S Pro showcases the XRING O1’s capabilities, delivering top-tier benchmark performance with premium design and AI-centric functionality. It features a Leica Summilux triple-camera system, a 2K ultra-bright LTM display, and Xiaomi’s proprietary Surge G1 and P3 chips for advanced battery and charging management. The launch underscores Xiaomi’s long-term commitment to semiconductor R&D, supported by over RMB 13.5 billion in investment to date and a pledged RMB 50 billion over the next decade.

  • XRING O1 is Xiaomi’s first flagship SoC, built on 3nm, with 19 billion transistors, 10-core CPU, and 16-core GPU
  • XRING T1 is Xiaomi’s first smartwatch SoC with in-house 4G baseband and eSIM support
  • Xiaomi 15S Pro launches with XRING O1 chip, Leica optics, and advanced AI features
  • SoC development backed by RMB 13.5B+ in R&D and a team of 2,500+ engineers
  • Xiaomi aligns OS, AI, and chip design into a unified, vertically integrated product strategy

“These chips represent more than a technical milestone — they’re a statement of Xiaomi’s long-term commitment to becoming a leader in core technologies,” the company stated during the event.

Tags: ChinaXiaomi
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