Xilinx plans to add acceleration enhanced technologies for the Data Center to its 16nm UltraScale+ product roadmap.
The resulting products will deliver the combination of Xilinx’s 16nm FinFET+ FPGAs with integrated High-Bandwidth Memory (HBM), and support for the recently announced Cache Coherent Interconnect for Acceleration technology (CCIX).
CCIX is initially driven by a group of seven companies to enable an acceleration framework that works with multiple processor architectures.
Specifically, Xilinx HBM-enabled FPGAs will improve acceleration capabilities by offering 10X higher memory bandwidth relative to discrete memory channels. HBM technology enables multi-terabit memory bandwidth integrated in package for the lowest possible latency.
“Having already delivered 19 billion transistors on a chip at 20nm leveraging our second generation 3D IC technology, we are creating a third generation 3D IC breakthrough for data center acceleration and other compute intensive designs,” said Victor Peng, executive vice president and general manager, Programmable Products at Xilinx. “When combined with next generation CCIX acceleration framework and our software defined SDAccel™ development environment, this technology will enable a new breed of high-density, flexible platforms for accelerating compute, storage and networking applications.”
