• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Tuesday, April 21, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Broadcom's DOCSIS 3.0 Cable Set-Top Chip Hits 120 Mbps Downstream

Broadcom's DOCSIS 3.0 Cable Set-Top Chip Hits 120 Mbps Downstream

January 4, 2006
in All
A A

Broadcom introduced a front-end cable TV set-top box chip with integrated channel bonding technology. Channel bonding is a DOCSIS 3.0 feature that significantly increases the transmission speed of a cable network. Channel bonding could enable MSOs to migrate to an all-IP network platform.

The new Broadcom BCM3255 set-top box chip can support up to 120 Mbps downstream data rates. The chip integrates three 1024/256 QAM
in-band demodulators, an out-of-band demodulator, DOCSIS 2.0+/3.0 cable modem technology, USB 2.0 MAC and PHY, and a 10/100 Fast Ethernet MAC (media access controller) and PHY (physical layer device). An integrated 800 DMIPS processor provides support for these next generation features including DOCSIS 2.0+/3.0 and channel bonding resequencing, DOCSIS set-top gateway (DSG) protocols, as well as networking protocol support for TCIP, IPnP and IPv6.

Broadcom designed its new BCM3255 set-top box chip to interface with its BCM7400 dual high-definition (HD) advanced video coding (AVC)/VC/MPEG-2 decoder chip. The new BCM7400 is a single-chip backend solution that supports the latest video compression technologies, including AVC and VC-1 for HD programming. The BCM3255 and BCM7400, when combined with multiple BCM3420 tuners, provide an HD AVC, digital video recording (DVR) cable TV media center design that can support channel speeds of up to 120 Mbps with multiple HD AVC streams, advanced downloadable conditional access system (DCAS) security features, up to 1600 DMIPs processing power, and a complete home networking management package. Broadcom packaged this complete solution into the BCM7400CAB reference design to provide its customers with a turnkey solution for next generation set-top box designs.

“Increasing the speed and performance capabilities of the cable network is a key element for MSOs as more and more telecommunications operators install fast, fiber-to-the-curb networks,” said Daniel Marotta, Senior Vice President and General Manager of Broadcom’s Broadband Communications Group.

http://www.broadcom.com

Tags: AllBlueprint columnsSilicon
ShareTweetShare
Previous Post

Marvell's Orion Processor Targets Multi-room HDTV

Next Post

Entropic Raises $25 Million for Coax Networking Silicon

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Blueprint: Brazil looks to municipal Wi-Fi 6E
Blueprints

Blueprint: Brazil looks to municipal Wi-Fi 6E

February 21, 2023
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
Next Post

Amino to Port IPTV Software Stack for ST's STB Platform

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version