• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, May 1, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Broadcom's Wireless Chips Support Android Mobile Platform

Broadcom's Wireless Chips Support Android Mobile Platform

February 4, 2009
in Uncategorized
A A

The software that controls Broadcom’s Wi-Fi/Bluetooth/FM combination silicon is a standard component of the latest Android operating system. Broadcom said this is the first time that the Android platform includes native support for a multi-functional wireless connectivity solution (or “combo” chip). Open access to portions of Broadcom’s combo drivers provides Android developers with a head-start in designing mobile devices and applications that utilize the best in wireless connectivity solutions.

The current generation of Android-based handsets features both Bluetooth and Wi-Fi, but uses discrete components.

“Two of the most exciting trends in the handset industry are the growing popularity of Android and the transition to combo chips for connectivity,” said Chris Bergey, Director of Broadcom’s Embedded WLAN line of business. “As a founding member of the Open Handset Alliance, we are committed to advancing the Android platform by contributing our software and facilitating greater access to our combination chips in the open source community. We expect a plethora of products and applications to evolve from the connected Android platform in the not-so-distant future.”http://www.broadcom.com

Tags: AllSilicon
ShareTweetShare
Previous Post

U.S. House Approves DTV Delay — New Cut-off date is June 12

Next Post

América Móvil Reaches 183 Million Mobile Users

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
Next Post

Infineon reports Sequential Quarterly Revenue Drop of 28%

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version