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Telehouse Launches Liquid Cooling Lab in London 

Telehouse Launches Liquid Cooling Lab in London 

Telehouse International Corporation of Europe has launched a liquid cooling lab at its London Docklands campus, partnering with Accelsius, EkkoSense, JetCool, and Legrand to showcase liquid cooling technologies designed to manage the increasing thermal demands of AI...

CHIPS for America allocates $3 billion for National Advanced Packaging

Department of Commerce Awards $53M CHIPS Incentive to HP

The U.S. Department of Commerce has awarded HP Inc. up to $53 million in direct funding under the CHIPS Incentives Program to support the expansion and modernization of HP’s semiconductor facility in Corvallis, Oregon. The investment will enhance HP’s lab-to-fab ecosystem,...

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