Semiconductors

The Ultra Accelerator Link (UALink) Consortium, backed by AMD, Amazon Web Services (AWS), Astera Labs, Cisco, Google, HPE, Intel, Meta, and Microsoft, has officially incorporated and is now welcoming new...

The U.S. Department of Commerce reached a preliminary agreement with Hemlock Semiconductor (HSC) to boost the domestic production of semiconductor-grade polysilicon. This non-binding memorandum details a proposed $325 million investment,...

The U.S. Department of Commerce has launched a new initiative under the CHIPS for America program, designed to strengthen domestic semiconductor manufacturing capabilities through advanced packaging technologies. Administered by the...

Wolfspeed has secured $1.5 billion in proposed funding, with $750 million from the U.S. CHIPS Act and an additional $750 million from a consortium led by Apollo, Fidelity, Baupost, and...

What role is custom silicon playing in scaling hyperscaler infrastructure? Nigel Alvares, VP of Global Marketing from Marvell explains: - Hyperscalers focus on scaling infrastructure optimized for performance, power, and...

The Open Compute Project Foundation (OCP) has launched the OCP Chiplet Marketplace, marking a major step towards realizing the Open Chiplet Economy. This platform provides System in Package (SiP) designers...

How is the industry adapting to compressed demand cycles in high-speed I/O? Hani Daou, Business Development Manager from Multilane explains: - Demand cycles are compressing between 112G, 224G, and 448G...

Intel and AMD have formed an x86 Ecosystem Advisory Group to drive the future of the world’s most widely used computing architecture. This new initiative will unite industry leaders to...

Marvell unveiled a custom 5nm network interface controller (NIC) ASIC designed in collaboration with Meta. The new solution, revealed at the 2024 OCP Global Summit, is tailored to meet Meta’s...

AMD has introduced the Pensando Pollara 400, a 400 Gbps RDMA Ethernet Network Interface Card (NIC) designed to meet the demands of modern AI and machine learning (ML) workloads. The...

AMD launched its 5th Gen EPYC processors, codenamed “Turin,” aimed at enterprise, AI, and cloud workloads. Featuring the new “Zen 5” core architecture, these CPUs are compatible with the SP5...

Credo Technology Group has launched its new 800G HiWire ZeroFlap (ZF) Active Electrical Cables (AECs) designed for AI backend networks. These advanced AECs provide enhanced reach, zero soft link flaps,...

Astera Labs unveiled its new Scorpio Smart Fabric Switch portfolio, targeting cloud-scale AI infrastructure with PCIe 6 connectivity. Designed for demanding AI workloads, the Scorpio switches aim to deliver high...