ESMC, a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V., has officially begun the initial phase of land preparation for its first semiconductor fab...
ESMC, a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V., has officially begun the initial phase of land preparation for its first semiconductor fab...
AMD announced it will acquire ZT Systems, a leading provider of AI and general-purpose compute infrastructure for hyperscale computing companies, in a transaction valued at $4.9 billion. The acquisition is...
Texas Instruments (TI) reached a preliminary agreement with the U.S. Department of Commerce to potentially receive up to $1.6 billion in funding under the CHIPS and Science Act. This financial...
Akeana, a start-up based in Santa Clara, California, emerged from stealth to unveil its RISC-V portfolio. The company has raised over $100 million in capital from prominent investors like Kleiner...
GCT Semiconductor signed a Memorandum of Understanding (MOU) with Samsung Electronics to accelerate the development and adoption of advanced 4G/5G chipsets and modules. This collaboration aims to enhance the global...
AMD has finalized its acquisition of Silo AI, Europe's largest private AI lab, in an all-cash deal valued at approximately $665 million. This acquisition underscores AMD's commitment to expanding its...
The Semiconductor Industry Association (SIA) has reported a strong performance in the global semiconductor market for the second quarter of 2024, with total sales reaching $149.9 billion. This marks an...
The Universal Chiplet Interconnect Express (UCIe) Consortium has unveiled its 2.0 Specification, marking a significant advancement in the standardization of system architecture for chiplet manageability. The new specification addresses key...
Groq, a start-up based in Mountain View, California, raised $640 million in a Series D round, bringing its valuation to $2.8 billion. The funding was spearheaded by BlackRock Private Equity...
Microsoft will integrate Marvell's NIST FIPS 140-3 Level-3 compliant LiquidSecurity hardware security modules (HSMs) into its Azure Key Vault and Managed HSM services. This update will enhance Microsoft's security posture...
The U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $450 million in proposed federal incentives under the CHIPS...
Intel reported disappointing financial results for the second quarter of 2024, prompting the tech giant to announce comprehensive job cuts and restructuring measures. The company revealed a 1% year-over-year decline...
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