AMD Reports Strong Q2 with 30% Growth in Data Center Segment
On July 30th, AMD reported a revenue of $5.8 billion, marking a 9% year-over-year increase. The company’s gross margin was 49%, with an operating income of $269 million and a...
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On July 30th, AMD reported a revenue of $5.8 billion, marking a 9% year-over-year increase. The company’s gross margin was 49%, with an operating income of $269 million and a...
Marvell introduced its new Structera product line of Compute Express Link (CXL) devices, aimed at resolving memory performance and scaling challenges in cloud data centers. These devices are designed to...
Marvell Technology announced the production and customer deployment of its flagship 51.2 Tbps programmable Teralynx 10 Ethernet switch chip for cloud data centers. The Teralynx 10 is engineered to support...
Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates designed for hyperscale data center compute applications. These advanced substrates are produced at SEMCO’s technology hub in...
NTT and Okayama University in Japan have developed a gigahertz ultrasonic circuit that utilizes the principle of topology. This innovative development promises to revolutionize the design and performance of ultrasonic...
Sivers Semiconductors AB (Sivers), a supplier of integrated chips and photonics modules for the most advanced communications and sensor solutions, appointed Vickram Vathulya as its new President & CEO, succeeding...
The U.S. Department of Commerce has announced a proposed investment of up to $400 million in direct funding under the CHIPS and Science Act to support GlobalWafers in constructing new...
The Department of Commerce and Natcast, operator of the National Semiconductor Technology Center (NSTC), have initiated the selection process for the first three R&D facilities funded by the CHIPS and...
SoftBank Group has acquired Graphcore, a UK-based start-up developing an Intelligence Processing Unit (IPU) platform designed for handling extremely large machine intelligence workloads. Graphcore’s latest Bow IPU leverages Wafer-on-Wafer (WoW)...
The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging in the United States. With up to $1.6 billion in...
Global sales of semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecasted to reach an unprecedented $109 billion in 2024, marking a 3.4% year-on-year growth, according to SEMI’s Mid-Year...
AMD agreed to acquire Silo AI, Europe’s largest private AI lab, for approximately $665 million in cash. This acquisition is a strategic move by AMD to enhance its end-to-end AI...
Applied Materials introduced groundbreaking materials engineering innovations designed to enhance the performance-per-watt of computer systems. These innovations enable copper wiring to scale to the 2nm logic node and below, addressing...
© 2025 Converge Digest - A private dossier for networking and telecoms.
© 2025 Converge Digest - A private dossier for networking and telecoms.