Toshiba Electronic Devices & Storage Corporation will construct a new 300-milimeter wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa...
Exapnding its choice of processors, Nokia confirmed that its Core Networks business will 3rd Gen AMD EPYC processors to power the servers that deliver Nokia Core cloud-native software products for...
by Benedict Chua, Associate EditorJuniper Networks is pushing ahead with its next generation Trio and Express ASICs for cloud and Service Provider networks.The 5th generation Express ASIC, which powers Juniper's...
Ceremorphic, a start-up based in San Jose, California, unveiled its chipset designed in advanced silicon geometry (TSMC 5nm node) and targeted at applications such as AI model training, HPC, automotive...
Intel will invest more than $20 billion in the construction of two new fabs in Ohio. The initial phase of the project is expected to create 3,000 Intel jobs and...
The following media comprises interviews and other content related to 2022 industry predictions. Views expressed are those of the presenting individuals and companies and may not necessarily represent views of Converge!...
The following media comprises interviews and other content related to 2022 industry predictions. Views expressed are those of the presenting individuals and companies and may not necessarily represent views of Converge!...
The following media comprises interviews and other content related to 2022 industry predictions. Views expressed are those of the presenting individuals and companies and may not necessarily represent views of Converge!...
Toshiba Electronic Devices & Storage Corporation introduced a new device in its line-up of Ethernet bridge ICs to provide support for 10Gbps communications in automotive information communications systems and industrial...
Renesas Electronics completed its previously announced acquisition of Celeno Communications for approximately US$315 million (approximately 35.9 billion yen at an exchange rate of 114 yen to the dollar) with payment...
IBM and Samsung Electronics unveiled a new class of Vertical Transport Field Effect Transistors (VTFET) - a breakthrough the companies say that could reduce energy usage by 85 percent compared...
The Finnish SoC Hub consortium, which is a collaboration between Tampere University, the government of Finland, and Nokia, has taped out its first System on Chip (SoC) design. The new Ballast...
The MIPI Alliance, announced a major update to its MIPI M-PHY physical-layer interface for connecting the latest generation of flash memory-based storage and other high data rate applications in advanced...
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