Intel outlined its path toward more than 10x interconnect density improvement in packaging with hybrid bonding, 30% to 50% area improvement in transistor scaling, major breakthroughs in new power and...
https://youtu.be/Pbi0zG7hGPwAs networks become more virtualized, both at the far edge and near edge, Open RAN is drawing more interest and participation from hyperscalers. In this video, Raj Singh, EVP Processor...
Analog Devices introduced its RadioVerse System-on-Chip (SoC) series for energy efficient 5G RUs.The ADRV9040 is the first in the new RadioVerse SoC series. It offers eight transmit and receive channels...
Expedera, a start-up based in Santa Clara, California announced a $18 million Series A funding round led by Dr. Sehat Sutardja and Weili Dai (founders of Marvell Technology Group) and...
Ethernet adapter shipments were stalled by supply constraints in 3Q, according to a new report by Dell'Oro Group, however shipments are forecast to return to double-digit growth in 2022, as...
Marvell has begun sampling the industry’s first 50Gbps PAM4 DSP and TIA chipset solution for 5G fronthaul.Key features of the new Marvell AtlasOne chipset:PAM4 digital core for optimal performance across...
Marvell and OE Solutions are collaborating on 100G QSFP-DD optical modules optimized for 5G backhaul and metro access applications.The OE Solutions 100G QSFP-DD Coherent Transceiver with the Marvell Deneb Coherent...
Marvell Technology reported revenue of $1.211 billion for the third quarter of fiscal year 2022, which exceeded the midpoint of the company's guidance provided on August 26, 2021. GAAP net loss...
Marvell confirmed that it is shipping SONiC-enabled production switch silicon of its Teralynx 9K and Prestera 8K devices in high-volume to tier-1 cloud customers. Marvell's Teralynx and Prestera devices support Switch...
KIOXIA America is now shipping its new EM6 Series Enterprise NVMe-oF™ solid state drives (SSDs) for Ethernet Bunch of Flash (EBOF) systems. The drives use the Marvell 88SN2400 NVMe-oF SSD converter...
Samsung Electronics introduced Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and networking chips that require high-performance and large-area packaging technology.2.5D...
Peter Kisang Kim, a former Broadcom engineer, has been indicted by a U.S. federal grand jury on 18 charges of trade secret theft.The indictment alleges that Kim worked as a...
At a virtual event ahead of this week's Open Compute Project Summit, Dr. Lisa Su, president and CEO of AMD, introduced the company's Instinct MI200 series accelerators for high performance...
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