Semiconductors

Arm confirmed that the shipment of a record 7.3 billion Arm-based chips by its silicon partners in the last calendar quarter of 2020, up 22% y-o-y. Arm partners also shipped...

Ampere Computing hosted a technology update event in which it said it on track to deliver by next year new CPU designs with cores designed in-house and optimized for cloud-native...

IBM unveiled a 2 nanometer semiconductor design and process breakthrough based on a new Gate-All-Around (GAA) nanosheet device architecture. The technology is implemented on a 300 millimeter (mm) wafer built...

Samsung Electronics Co. has begun implementing its next-generation 2.5D chip packaging technology Interposer-Cube4 (I-Cube4).Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU,...

Intel announced plans to $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, its 3D packaging technology.Foveros advanced 3D packaging technology...

Alphawave IP, a start-up offering DSP-based silicon IP building blocks, has filed registration statements for a planned listing on the London Stock Exchange.Recently, Alphawave announced the successful silicon bring up...

Renesas Electronics and SiFive agreed to jointly develop next-generation, high-end RISC-V solutions for automotive applications. The partnership will also include SiFive licensing the use of their RISC-V core IP portfolio...

Marvell Technology completed its previously announced acquisition of Inphi Corporation.  The combination creates a U.S. semiconductor powerhouse positioned for end-to-end technology leadership in data infrastructure.“I am excited to welcome the...

Cerebras Systems, a start-up developing a Wafer Scale Engine (WSE) chip that contains 1.2 trillion transistors, covers more than 46,225 square millimeters of silicon and contains 400,000 AI optimized compute...

NVIDIA outlined a roadmap for the next two generations of its BlueField data processing unit (DPU) chips.The current generation, BlueField-2, is now shipping and features dual 100Gb/s Ethernet or InfiniBand...

Achronix announced sampling of its 7nm Speedster 7t AC7t1500 FPGAs to customers ahead of schedule. The Speedster7t family targets high bandwidth workloads in AI/ML, 5G infrastructure, networking, computational storage, and test/measurement.Achronix...

Cadence Design Systems has optimized its chip design software for Samsung Foundry’s advanced-process technologies down to 4nm. The companies said Cadence digital 20.1 flow provides capabilities that are well-suited for Samsung...

Intel launched its 3rd Gen Xeon Scalable processors (code-named “Ice Lake”) featuring an average 46% improvement on popular data center workloads over the previous generation.The new Xeon processors, which are...