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Home » Celestial AI Expands IP with Rockley Photonics Patent Acquisition

Celestial AI Expands IP with Rockley Photonics Patent Acquisition

October 22, 2024
in Optical
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Celestial AI has acquired the silicon photonics patent portfolio from Rockley Photonics, adding over 200 patents to its growing collection of intellectual property (IP). The newly acquired portfolio includes key technologies such as optoelectronic systems-in-package, electro-absorption modulators (EAMs), and optical switch technology. These innovations are critical to AI data center infrastructure and align closely with Celestial AI’s Photonic Fabric™ technology platform, which focuses on advanced optical compute interconnect solutions.

Rockley Photonics, an early innovator in silicon photonics, has held foundational patents since 2014. The acquisition strengthens Celestial AI’s position in the optical interconnectivity space and accelerates its roadmap for delivering high-performance, energy-efficient solutions to hyperscale data centers. This IP acquisition is part of Celestial AI’s broader strategy to expand its portfolio and support the commercialization of its cutting-edge Photonic Fabric™.

• Acquisition adds over 200 global patents

• Key technologies include optoelectronic systems-in-package, EAMs, and optical switches

• Aligns with Celestial AI’s Photonic Fabric™ platform for AI data center solutions

• Rockley’s IP dates back to 2014, preceding many competitors

• Focused on scalability, performance, and energy efficiency for hyperscale data centers

“The addition of Rockley’s IP into our technology platform further accelerates the growth of Celestial AI’s highly valuable intellectual property portfolio,” said Dave Lazovsky, Founder and CEO of Celestial AI.

  • Celestial AI is working on Optical Compute Interconnect (OCI) to enable disaggregation of scalable data center memory and accelerated computing. The company says its Photonic Fabric is unconstrained by package beachfront limitations and can deliver data to any location on the compute die, directly to the point of consumption. It promises greater scalability and more than 10X lower latency and power consumption compared with any optical interconnect alternative, such as Co-Packaged Optics (CPO).
Tags: Mergers and Acquisitions
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