• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Thursday, April 30, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Conexant Debuts ADSL2plus Central Office Chipset

Conexant Debuts ADSL2plus Central Office Chipset

November 12, 2006
in Uncategorized
A A

Conexant Systems introduced its ADSL2plus central office (CO) system-on-chip (SoC) solution featuring 16- and 24-port configurations.

The company said its two new devices support all recent amendments to the ADSL2plus standards and are optimized for IPTV, video on demand (VOD), and high-definition television (HDTV) programming.

Key features include:

  • Enhanced Impulse Noise Protection (INP): Additional memory has been integrated into the chip to support INP, which facilitates the delivery of better quality video.
  • Dual-latency with dual-interleaving: Allows carriers to simultaneously deliver error-free video and data content with the appropriate level of error protection for each service, while maximizing channel capacity.
  • Dynamic spectrum management (DSM) Levels 1 and 2: Improves rate/reach performance via optimum spectrum shaping and balancing. This enables telcos to significantly boost broadband access subscriber rates over their existing copper infrastructure, eliminating the need for a costly network upgrade.
  • Mask-on-Demand (MoD): A DSM Level 1 innovation developed by Conexant that improves performance improvement in medium and long range loops. This adaptive version of reach-extended ADSL (READSL) boosts loop reach, and upstream and downstream rates by optimizing the shape of the transmit power spectral density design. This allows carriers to increase their geographic coverage area and expand their customer base.
  • RemedyDSL: An extensive loop diagnostic capability that helps operators pre-qualify, diagnose and maintain loops for DSL operation.

Both new chipsets can be used in conjunction with Conexant’s Columbia family of DSLAM processors for next-generation CO digital loop carriers, optical network units, and multiple dwelling/tenant unit (MDU/MTU) applications. In addition, a universal digital signal processor (DSP) ensures design compatibility across all of Conexant’s ADSL and VDSL product lines, further maximizing design flexibility and reducing system and design-in costs.

Sampling is currently underway with production scheduled for early 2007.

http://www.conexant.com

Tags: AllSilicon
ShareTweetShare
Previous Post

Kai-Uwe Ricke resigns as Deutsche Telekom CEO

Next Post

Analog Devices Posts Revenue of $644.3 Million

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
Next Post

BT Outlines New Wholesale Broadband Pricing

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version