Discera, a start-up based in Campbell, California raised $12 million in series B funding for its ultra-miniaturized components targeted at the wireless industry. Discera’s Silicon Resonator platform dramatically shrinks wireless architectures by miniaturizing and consolidating passive components in circuitry. Discera’s resonator products are in part based on the use of tiny micro-machined silicon beams that vibrate (resonate) at various frequencies. Multiple beams, each about 20 microns in length, can be fabricated in banks onto a single 1mm x 1mm chip, replacing several single-frequency quartz crystals or filter components that are typically many times bigger. The silicon resonators allow wireless circuitry providers to keep RF component counts lower at a time when mobile equipment users are demanding more functions.
The new funding came from 3i and Partech International and strategic investor QUALCOMM Incorporated. Existing investor Ardesta LLC also participated in the round. http://www.discera.com
