At ECOC24, OE Solutions is introducing its new External Laser Small Form Factor (ELSFP) module, designed to meet growing demand for high-speed networking. The ELSFP uses Co-Packaged Optics (CPO) technology to deliver high optical power for critical components like switches, network interface cards, and AI applications. Its compact design and low power consumption make it an ideal fit for data centers, metro networks, and 5G infrastructure. The product complies with Optical Internetworking Forum (OIF) standards, ensuring compatibility with existing optical networks.
OE Solutions sets itself apart by designing and producing its own lasers, giving the company greater control over the entire manufacturing process. This enables them to fine-tune the ELSFP to meet diverse requirements across industries. The company plans to begin sampling the ELSFP in Q4 2024, with general availability expected in the first half of 2025.
Key points:
• Product: External Laser Small Form Factor (ELSFP) module
• Technology: Co-Packaged Optics (CPO)
• Applications: Data centers, metro networks, 5G infrastructure, AI
• Compliance: Optical Internetworking Forum (OIF) standards
• Availability: Sampling Q4 2024, general release in H1 2025
“We are thrilled to introduce our innovative ELSFP solution to the market,” said Walter Lee, Executive Vice President and Global CMO of the Optical Transceiver Business Unit at OE SOLUTIONS. “Our commitment to innovation and our deep understanding of optical technology have enabled us to develop a product that sets a new standard for performance and efficiency. We believe that the ELSFP will play a crucial role in driving the next generation of high-speed optical networks.”
