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Home » GlobalFoundries Partners with Singapore’s A*STAR of Packaging R&D

GlobalFoundries Partners with Singapore’s A*STAR of Packaging R&D

May 20, 2025
in Semiconductors
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GlobalFoundries (GF) has signed a Memorandum of Understanding with Singapore’s Agency for Science, Technology and Research (ASTAR) to accelerate research and development in advanced semiconductor packaging. The collaboration will grant GF access to ASTAR’s R&D infrastructure and technical expertise, while GF will contribute critical equipment to support A*STAR’s research initiatives. The agreement is part of GF’s broader effort to expand its packaging capabilities to meet growing global demand for AI, high-performance computing, and next-generation communication technologies.

The partnership aims to fast-track GF’s advanced packaging roadmap and scale the development and deployment of compact, energy-efficient solutions. These will be manufactured, packaged, and tested at GF’s Singapore facility, enhancing its ability to offer integrated chip production services. Workforce development is also a key component of the collaboration, with both organizations committed to upskilling semiconductor professionals and developing local talent for the advanced packaging sector.

“With a robust semiconductor ecosystem and strong R&D support from the government and institutions like ASTAR, Singapore is an ideal location for us to develop and scale our essential innovations at the foundry level,” said Gregg Bartlett, Chief Technology Officer at GlobalFoundries. Terence Gan, Executive Director at ASTAR’s Institute of Microelectronics, added, “A*STAR looks forward to working closely with GlobalFoundries to accelerate innovation and talent development in advanced packaging technologies and become leaders in this domain.”

  • GlobalFoundries signs MOU with A*STAR to expand advanced packaging R&D in Singapore
  • GF will contribute equipment; A*STAR provides technical support and access to research facilities
  • Collaboration supports AI, data center, and next-gen communication applications
  • Includes workforce skills development for GF employees
  • Complements GF’s January announcement to establish a U.S.-based packaging and photonics center
  • GlobalFoundries established its presence in Singapore in 2010 through the acquisition of Chartered Semiconductor, one of Asia’s leading semiconductor foundries at the time. This move significantly expanded GF’s global manufacturing footprint and positioned Singapore as a key hub for the company’s operations in Asia. Over the years, GF has continued to invest in its Singapore facility, which is now one of its most advanced and high-volume manufacturing sites, producing a broad range of chips for mobile, automotive, industrial, and communications markets. 
  • GlobalFoundries (GF) was established in 2009 as a spin-off from AMD’s manufacturing operations, with the goal of becoming an independent, pure-play semiconductor foundry. Initially backed by the Mubadala Investment Company of Abu Dhabi, GF rapidly expanded its capabilities through key acquisitions, including Chartered Semiconductor in Singapore (2010) and IBM’s Microelectronics business (2015), which brought advanced RF and semiconductor technologies into its portfolio. Headquartered in Malta, New York, GF now operates manufacturing facilities across the United States, Germany, and Singapore.
Tags: GlobalFoundriesSingapore
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