• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, April 15, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Intel intros facial authentication solution

Intel intros facial authentication solution

January 6, 2021
in All
A A

Intel introduced an on-device, facial authentication solution that combines an active depth sensor with a specialized neural network. The technology could be used for smart locks, access control, point-of-sale, ATMs, kiosks, etc.

Intel said its RealSense ID technology integrates anti-spoofing features and can adapt to users over time as they change physical features, such as facial hair and glasses. 

“Intel RealSense ID combines purpose-built hardware and software with a dedicated neural network designed to deliver a secure facial authentication platform that users can trust,” said Sagi Ben Moshe, Intel corporate vice president and general manager of Emerging Growth and Incubation.

https://newsroom.intel.com/news/introducing-intel-realsense-id-facial-authentication

Tags: Blueprint columnsIntel
ShareTweetShare
Previous Post

T-Mobile US cites progress with 5G rollout

Next Post

L-com intros passive CWDM Mux/Demux products

Staff

Staff

Related Posts

Intel Q3 2025: AI Partnerships, Foundry Momentum, and U.S. Backing 
All

Intel Q3 2025: AI Partnerships, Foundry Momentum, and U.S. Backing 

October 23, 2025
Intel Ramps 18A Production at Fab 52
Semiconductors

Intel Ramps 18A Production at Fab 52

October 9, 2025
Intel Foundry Services forms USMAG Alliance
Semiconductors

NVIDIA and Intel Forge $5B Partnership to Build Data Center and PC Chips

September 18, 2025
Intel’s Q3 data center revenue dropped 27% yoy
Financials

Intel Names New Data Center, Client, and Foundry Leaders

September 8, 2025
Intel cites progress with U.S. fabs
Semiconductors

U.S. Takes 9.9% Stake in Intel with $8.9B Equity Investment

August 22, 2025
Intel breaks ground on its new fab in Ohio
Financials

Intel Posts Flat Revenue for Q2, Restructuring and Impairments

July 24, 2025
Next Post
L-com intros passive CWDM Mux/Demux products

L-com intros passive CWDM Mux/Demux products

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version