Nitero, a start-up based in Austin, Texas with a design studio in Melbourne, Australia, unveiled its 60 GHz chip implemented in CMOS and based on the IEEE 802.11ad. standard. The device uses Samsung’s advanced 28nm RF process based on 28nm HKMG LPP technology.
Nitero said its design is up to 10x more power efficient than 802.11ad solutions designed for the PC, while bringing cost and form-factor in-line with existing 802.11ac Wi-Fi solutions. Nitero’s NT4600 supports low-latency 4K display and peer-to-peer wireless connectivity at USB 3.0 data rates. In addition, while single-antenna 802.11ad solutions sacrifice in-room performance to get to low power, the NT4600 supports transmit and receive beamforming to provide full coverage throughout the office, living room or conference room.
“802.11ad, the next generation of Wi-Fi, is the missing link to allow for the long-awaited convergence of PC, gaming and entertainment platforms onto a single mobile device. 802.11ad solutions built for the PC and slimmed down for mobile simply can’t meet the power, performance, and form-factor requirements of Tier 1 mobile customers,” said Pat Kelly, CEO of Nitero. “At Nitero, we targeted the smartphone from day one. The result is 60G.”
Key features of Nitero’s 60G:
- Samsung 28nm RF CMOS process technology
- Power reduced by up to 10x over PC 802.11ad solutions
- Industry-leading output power, noise figure and sensitivity to maximize performance
- Transmit and receive beamforming to support non-line-of-sight conditions
- Low-latency 4K wireless display support in living-room, desktop, and conference-room environments
- Peer-to-peer wireless connectivity using 16-QAM modulation at up to 4.6 Gbps
- PCI Express host interface to support the latest mobile applications processors while minimizing software overhead
- Fully-compliant to the ratified IEEE 802.11ad standard
- Android driver support
Nitero is currently demonstrating the NT4600 to select partners and customers and will start production shipments in 2015.
- Nitero is funded by leading venture capitalists with deep semiconductor roots – Austin Ventures, Southern Cross Venture Partners and Trailblazer Capital.
