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Home » NTT DOCOMO Cancels Plans for Silicon JV

NTT DOCOMO Cancels Plans for Silicon JV

April 1, 2012
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NTT DOCOMO terminated an agreement concerning the establishment of a joint venture company to develop and sell semiconductor products for mobile devices, which the company signed with Fujitsu Limited, Fujitsu Semiconductor Limited, NEC Corporation, Panasonic Mobile Communications Co., Ltd. and Samsung Electronics Co., Ltd. in December 2011.

NTT DOCOMO said it was canceling the joint-venture agreement because a consensus on the details of the envisioned company could not be reached by the target deadline, the end of March.
http://www.ntt.co.jp

  • In February, NTT DOCOMO, NEC, Panasonic Mobile Communications and Fujitsu announced plans to join forces to develop the software and hardware intellectual property for a single large-scale integration (LSI) chip that will enable small, energy-efficient modems to support the GSM, W-CDMA, HSPA+ and LTE mobile standards. The companies said the first prototype chips had already been taped out and tested. All mobile broadband standards supported by the chip meet 3GPP specifications. The LTE standard supports FDD (Frequency Division Duplexing) mode adopted by DOCOMO and TDD (Time Division Duplexing) mode expected to be adopted for LTE networks in China and other markets, which will help to further the development of advanced mobile devices by manufacturers worldwide.
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