The Optical Internetworking Forum (OIF) members approved three Implementation Agreements (IAs) addressing the needs for smaller modules for 100G deployments:
- The 100G Long-Haul DWDM Transmission Module IA specifies key electromechanical aspects of Generation 2.0 of a 100G Long-Haul DWDM Transmission Module, for optical line interface and specifically 100G PM-QPSK long-haul DWDM transmission applications. The module size has been decreased by 40% to 4×5 inches to accommodate technological advances made since the first module was introduced and to reflect lower power consumption.
- The Integrated Polarization Multiplexed Quadrature Modulated Transmitters IA specifies key aspects of optical transmitters operating at rates up to 32 GBd per channel for applications such as 100G PM-QPSK DWDM transmission. The agreement reduces the size of the transmitter to fit into the Gen 2 LH DWDM Transmission Module.
- The Intradyne Coherent Receivers IA also targets 100G PM-QPSK applications with nominal rates up to 32 GBd. This IA reduces the size of the receiver to fit within the smaller 4×5 module and also will now fit into future CFP modules.
A fourth implementation agreement defines medium reach Common Electrical I/O (CEI)-28G-MR, for an electrical channel operating at peak speeds. This expands on the OIF’s CEI work that defines the characteristics required to communicate between a CEI-28G-MR transmitter and a CEI-28G-MR receiver. This clause details the requirements for the CEI-28G-MR medium reach high-speed electrical interface between nominal baud rates of 19.90 Gsym/s and 28.1 Gsym/s using NRZ coding. Medium reach is defined as capable of driving up to 500 mm of PCB and up to 1 connector.
“100G DWDM represents a significant development expense for component and system suppliers,” said Nathan Tracy of TE Connectivity and the OIF technical committee chair. “The original implementation agreements for 100G have been refreshed to support second generation smaller form factor modules and the expectation for future pluggable modules. Smaller form factor modules enable higher density, lower power equipment.”
