QUALCOMM outlined its roadmap to “Ultra Mobile Broadband” delivered using its next-generation Cell Site Modem (CSM) CSM8900 and Mobile Data Modem chips. QUALCOMM will support the latest 3GPP2 UMB standard, expected to be finalized within the first half of this year. QUALCOMM is positioning the technology as an evolutionary upgrade within the family of CDMA2000 standards that can be deployed in existing or new spectrum allocations using scalable bandwidths up to 20 MHz.
QUALCOMM said UMB technology incorporates the benefits of OFDMA, CDMA and other air interface techniques with MIMO and advanced antenna technologies to offer features such as support for broadband speeds, greater capacity and coverage, and an enhanced user experience for future mobile services.
The MDM8900 modem solution, which will provide support for up to 40 Mbps on the downlink and 10 Mbps on the uplink, will interface with the Mobile Station Modem (MSM) MSM7850 to offer a complete mobile device solution that takes advantage of new services enabled by UMB.
The CSM8900 cell site solution features a new single-sector architecture and leverages QUALCOMM’s Snapdragon technology. It also supports 4×4 MIMO and serial input/output. Sampling of the MDM8900 is scheduled for the first quarter of 2008, and sampling of the CSM8900 is scheduled for the second quarter of 2008.
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