Qualcomm completed the first phone call on a 3G chip manufactured with 45 nanometer (nm) process technology. The device was produced by Taiwan Semiconductor Manufacturing Company. Qualcomm recently taped out on its low-power-optimized 45 nm process using advanced immersion lithography and extreme low-k inter-metal dielectric material.
Qualcomm said 45 nm technology will enable chips that feature higher speeds, lower power consumption and enhanced integration, all with reduced die cost by providing more die per wafer.
Qualcomm is preparing to introduce three new 45 nm single-chip solutions designed to enable mass-market smartphones. The QSC7230 for HSPA+ devices, QSC7830 for CDMA2000 1xEV-DO Rev. B devices, and multi-mode QSC7630 for both HSPA+ and EV-DO Rev. B are the fifth generation of dual-core solutions from Qualcomm.
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