Ralink Technology introduced a chipset capable of simultaneous 300 Mbps 2×2 MIMO dual band 802.11n and Bluetooth 3.0+HS operation. 
The half MiniCard, which is designed for PCs, notebooks, netbooks and connected mobile devices, provides concurrent operation of dual-band 802.11n Wi-Fi and Bluetooth’s highest performance modes. Peer-to-peer gaming, shared and tethered connections can now be initiated via Bluetooth 3.0+HS detection and setup while 2×2 MIMO 802.11n dual-band Wi-Fi boosts data rates to 300Mpbs. The company said its chipset eliminates interference by allowing Wi-Fi and Bluetooth components to coexist in the same band or to function in separate frequency bands. It dynamically adjusts WLAN and Bluetooth transmission parameters to reduce interference, maximize performance, and automatically adjust to the presence and operating characteristics of nearby Wi-Fi networks.
Ralink Technology also introduced its two next generation xDSL2+ 11n Wi-Fi IAD (Integrated Access Device) solutions/ The ADSL2+ and 802.11n CPE solution, which is applicable for ADSL single-port 1T1R/2T2R and four-port 1T1R/2T2R 802.11n Wi-Fi gateways, also supports a variety of peripherals via USB2.0 host interface to meet customer demand for digital home peripherals and applications such as connecting media server disk drives and optional 3G connections.
http://www.ralinktech.com
- Earlier this year, Ralink Technology, a leading supplier of WiFi silicon solutions, acquired TrendChip Technologies Corporation, a leading supplier of DSL chipsets. Both companies are listed on the listed on Taiwan’s TAIEX exchange.
