Rayspan, a start-up based in San Diego, raised $12.5 million in venture funding for its work with metamaterial air interface for wireless communications.
Rayspan said its metamaterials provide breakthrough improvements in antenna and RF front-end component miniaturization, performance, cost reduction and ease of manufacture. The technology support a full range of fixed and mobile wireless WAN and LAN applications including all 2/3/4G cellular handsets, WiFi, Bluetooth and GPS.
The new Series B financing was led by new investor Khosla Ventures, who was joined by existing Rayspan investor Sequoia Capital as well as individual private investors. http://www.rayspan.com
