Tag: Silicon

Marvell has begun sampling the industry's first 1.6T Ethernet PHY with 100G PAM4 electrical input/outputs (I/Os) in 5nm, enabling next-generation ...

Marvell announced sampling of is new Deneb ultra-low power, multi-mode 400G DSP for disaggregated optical platforms. The new 7nm CDSP for ...

TSMC cited progress with its "3DFabric" advanced packaging and chip stacking technologies at the company’s online 2021 Technology Symposium. TSMC will ...

Arm confirmed that the shipment of a record 7.3 billion Arm-based chips by its silicon partners in the last calendar ...

Ampere Computing hosted a technology update event in which it said it on track to deliver by next year new ...

IBM unveiled a 2 nanometer semiconductor design and process breakthrough based on a new Gate-All-Around (GAA) nanosheet device architecture. The ...

Samsung Electronics Co. has begun implementing its next-generation 2.5D chip packaging technology Interposer-Cube4 (I-Cube4).Samsung’s I-Cube is a heterogeneous integration technology ...

Intel announced plans to $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, ...

Alphawave IP, a start-up offering DSP-based silicon IP building blocks, has filed registration statements for a planned listing on the ...

Renesas Electronics and SiFive agreed to jointly develop next-generation, high-end RISC-V solutions for automotive applications. The partnership will also include ...

Marvell Technology completed its previously announced acquisition of Inphi Corporation.  The combination creates a U.S. semiconductor powerhouse positioned for end-to-end ...

Cerebras Systems, a start-up developing a Wafer Scale Engine (WSE) chip that contains 1.2 trillion transistors, covers more than 46,225 ...

NVIDIA outlined a roadmap for the next two generations of its BlueField data processing unit (DPU) chips.The current generation, BlueField-2, ...