Achronix samples 7nm Speedster FPGA
Achronix announced sampling of its 7nm Speedster 7t AC7t1500 FPGAs to customers ahead of schedule. The Speedster7t family targets high bandwidth ...
Tag: Silicon
Cadence collaborates with Samsung Foundry on process nodes down to 4nm
Cadence Design Systems has optimized its chip design software for Samsung Foundry’s advanced-process technologies down to 4nm. The companies said Cadence ...
Intel intros 3rd Gen Xeon including four NFV optimized versions
Intel launched its 3rd Gen Xeon Scalable processors (code-named “Ice Lake”) featuring an average 46% improvement on popular data center ...
OpenFive intros Die-to-Die PHY
OpenFive, a SiFive Business Unit, introduced a Die-to-Die (D2D) PHY that complements the company’s existing D2D Controller to offer complete ...
Arm aims v9 at secure processing from edge to core
Arm introduced its v9 architecture which is expected to become the processing basis for hundreds of billions of devices in ...
Analog Devices launches ASIC for O-RAN compliant radios
Analog Devices announced an ASIC-based radio platform for O-RAN compliant 5G radio units. The solution includes all the core functionality ...
Marvell and Samsung collaborate on Massive MIMO chip
Samsung Electronics and Marvell have jointly developed a new System-on-a-Chip (SoC) to power Samsung’s Massive MIMO and other advanced radios.The ...
NXP debuts Microsoft Azure Sphere-certified processor for IoT
NXP introduced its first cloud-secured crossover applications processor, the i.MX 8ULP-CS with Azure Sphere. The processor is based on the ...
Qualcomm shows its Snapdragon 780G 5G chipset
Qualcomm Technologies introduced its Snapdragon 780G 5G Mobile Platform featuring a triple Image Signal Processor (ISP) capable of capturing from ...
Samsung’s 512GB DDR5 module targets bandwidth-intensive apps
Samsung Electronics began sampling a 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology. The memory module delivers more ...
Intel sets course with new integrated device manufacturing strategy
Intel CEO Pat Gelsinger outlined the company’s path forward to an integrated device manufacturing model. The IDM2 strategy has 3 ...
DARPA seeks to boost domestic manufacturing of structured ASICs
The U.S. Defense Advanced Research Projects Agency (DARPA) is launching an industry collaboration with Intel to expand access to domestic ...
Xilinx shrinks its UltraScale+ FPGAs with TSMC’s InFO packaging
Xilinx expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. The company's Artix and ...
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